Applied Materials

SANTA CLARA, CA, August 11, 2009 -- Applied Materials, Inc. (Nasdaq:AMAT) today reported results for its third fiscal quarter ended July 26, 2009. Net sales were $1.13 billion, and the GAAP net loss was $55 million, or $0.04 per share. The company also reported a non-GAAP net loss for the period of $2 million, or breakeven per share.

ARMONK, NY, June 30, 2009 -- IBM (NYSE: IBM) Corporation today announced that it has signed a five-year strategic agreement to provide Applied Materials, Inc. (NASDAQ: AMAT), the global leader in nanomanufacturing technology solutions, with information technology (IT) application development and maintenance services.

Under the agreement, IBM will be responsible for software application development, support and deployment. It will help centralize application support and increase efficiencies for Applied by providing a stable, flexible and scalable IT platform for its worldwide operations.

SANTA CLARA, CA, May 31, 2009 -- Applied Materials, Inc. (Nasdaq:AMAT) today introduced its Applied Charger™ UBM PVD system that defines a new standard in metal deposition productivity and reliability for chip packaging. Specifically designed for under-bump metallization (UBM), redistribution layer and CMOS image sensor applications, the Charger system’s new linear architecture more than doubles the wafer output of competing systems to deliver the highest productivity available.

SANTA CLARA, CA, March 30, 2009 -- Applied Materials, Inc. (Nasdaq:AMAT) and DISCO Corporation (TOKYO:6146) today announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSVs) in 3-dimensional (3-D) semiconductors. The two companies will be working together to develop integrated, high-performance process flows intended to lower the cost, reduce the risk and accelerate time to market for customers’ next generation chips.